With its miniature footprint of just 4.6 mm x 5.6 mm and slim insertion height of 1.0 mm, the Bluetooth 4.0 LE module claims to be the world’s smallest module for Bluetooth Smart devices in production. Thanks to its compact size, the module is well suited for use in emerging wearable devices, a market that market researchers expect will grow rapidly in the near future.
The module is based on the company’s proprietary SESUB technology (semiconductor embedded in substrate). The Bluetooth IC die is embedded into the thin substrate, and all the peripheral circuitry, including a quartz resonator, bandpass filter and capacitors, is integrated on top. As a result, the Bluetooth low energy module is nearly 65 percent smaller than modules that employ discrete components. Its substrate layers optimally route all of the I/Os to a BGA on the module’s bottom surface, enabling designers to take full advantage of the chip’s functionality. The module thus facilitates the hardware design process and allows easy implementation of Bluetooth connectivity simply by connecting it to a power supply and antenna.
Mass production of the SESUB-PAN-T2541 began in February 2014.