This is achieved by application of precision thin film fabrication with integrated resistors, coupled with DLI’s high permittivity ceramic materials, to provide a high performance and repeatable design solution.
DLI product PDW05758 provides broad band performance in a compact and convenient surface mount package for easy integration. At 0.160-inch (4.06 mm) x 0.185-inch (4.7 mm) this divider can replace both packaged MMIC based devices as well as larger dividers integrated into printed wiring boards (PWB) without sacrificing performance.
The power divider utilizes a proprietary ceramic substrate. This high permittivity, yet temperature stable, substrate allows for the design of the power divider without typical parasitic effects associated with MMIC base solutions. The result is broad band 6 GHz to 18 GHz operation. The return loss and isolation are typically 20 dB or better throughout the band of operation while the mid band insertion loss is typically 0.4 dB.
This power divider is ideal for applications in which PWB space is of a premium. The divider is significantly smaller than what could be internally designed in typical printed wiring boards. As the part is manufactured with traditional thin film processes a greater degree of consistency and repeatability over that of printed wiring board construction is achievable. Moreover as the resistors are integrated internally and located also with ‘thin film precision’ the amplitude and phase balance are far superior to what can be achieved with traditional surface mount resistors soldered onto a printed wiring board.