News about Texas Instruments
2012 chip market to grow 7%
May 1, 2012
Growth in the semiconductor market will accelerate in the second half of 2012 and achieve an annual percentage figure of 6 to 7 percent, according to Mali Venkatesan, research manager for semiconductors at International Data Corp.
Read more
GainSpan reference design code for TI MSP430 offers easy Wi-Fi connectivity
April 30, 2012
GainSpan® Corporation has introduced reference design code for Texas Instruments' MSP430 that significantly reduces the development time to add Wi-Fi connectivity to embedded systems based upon this microcontroller (MCU). This code makes it possible for designers to rapidly develop their application on the MSP430 and easily communicate with a GainSpan Wi-Fi module of choice through a serial interface, using straightforward AT commands, with the GainSpan Wi-Fi module providing all Wi-Fi and networking functionalities.
Read more
Stereo spatial array IC brings immersive audio experience to smartphones and tablets
April 19, 2012
Texas Instruments Incorporated has introduced an IC that converts a smartphone or tablet computer’s narrow soundstage into a much wider audio experience for consumers to offer a more immersive audio experience.
Read more
Broadcom, Qualcomm, CSR, and Texas Instruments are benefiting from $8 billion wireless connectivity IC market
April 18, 2012
Wireless connectivity ICs totaled more than $8 billion in 2011 and will produce revenues close to $40 billion for Bluetooth, Wi-Fi, NFC, GPS, and combo ICs through 2016 according to ABI Research.
Read more
Multicore DSPs deliver performance and low power in small form factor
March 27, 2012
Texas Instruments has unveiled three devices based on its KeyStone multicore architecture utilizing the TMS320C66x DSP generation. The TMS320C665x DSPs feature combined fixed- and floating-point capabilities, delivering real-time high performance at low power coupled with smaller form factors.
Read more
TI announces partnership to take OMAP into robotics
March 13, 2012
Texas Instruments Inc., (Dallas, Texas) has announced a partnership with iRobot Corp., to develop robotics technology based on the TI's OMAP application processors.
Read more TI and Aricent collaborate on small cell protocol stack optimized for KeyStone multicore processors
February 27, 2012
Texas Instruments and Aricent® are to collaborate on a small cell protocol stack optimized for KeyStone-based multicore System-on-Chips (SoCs) from Texas Instruments. With this integrated approach both companies will be able to more quickly, easily and cost effectively design small cell base stations.
Read more Avago, TI hit signal milestones
January 30, 2012
Avago Technologies and Texas Instruments are among the companies at DesignCon this week with new components to drive boards and cables to higher data rates over longer distances for less power and cost. They and their competitors are gearing up to enable a next-generation of systems using 100 Gbit/s Ethernet and 10+ Gbit/s interfaces.
Read more Texas Instruments shows off Pico HD projector that fits into a smartphone
January 23, 2012
Texas Instruments Inc. was keeping its eye on the big picture, through its littlest chipsets. The firm was literally beaming as it showed off its latest generation of DLP projector chipset, the Pico HD, capable of HD WXGA resolution projections from up to 100 inches away.
Read more High performance AFE targets femtocells and SDR
January 20, 2012
Texas Instruments claims to have introduced the industry's fastest, highest-performance analog front end (AFE) for femtocell base stations and portable software-defined radio (SDR) applications. The low-power, 12-bit AFE7225 integrates a dual 125-MSPS analog-to-digital converter (ADC) and dual 250-MSPS digital-to-analog converter (DAC).
Read more KeyStone multicore architecture scaled to support cloud RAN applications
December 5, 2011
Texas Instruments (TI) has unveiled an expansion of its KeyStone multicore architecture for emerging cloud radio access network (C-RAN) applications and network server developers. Specifically, TI is scaling its KeyStone SoC architecture for the emerging paradigm of C-RAN base stations, enabling the creation of device pools with immense capacity for manufacturers to develop high performance and power efficient C-RAN base station clusters.
Read more Sub-1GHz wireless connection kit for TI LaunchPad development kit
November 30, 2011
Texas Instruments has launched a sub-1 GHz radio frequency (RF) low cost plug-in-board for its MSP430 microcontroller LaunchPad development kit. The 430BOOST-CC110L RF BoosterPack includes ETSI-compliant and FCC-certified modules to help speed development time, reduce certification costs and eliminate barriers associated with the RF hardware design process.
Read more SoC wireless audio products feature USB support
October 23, 2011
Texas Instruments has introduced two system-on-chip (SoC) devices in the PurePath™ Wireless audio product family, aimed at delivering uncompressed, CD-quality wireless multichannel and multipoint audio streaming capabilities to consumer applications with USB ports, such as PCs, TVs, set top boxes, game consoles and more.
Read more Sub-1 GHz 6LoWPAN solutions deliver mesh wireless Internet connectivity to metering networks
September 27, 2011
Texas Instruments Incorporated has introduced new sub-1 GHz 6LoWPAN solutions, aimed at providing a gateway for remote, low-cost wireless sensors to connect to the Internet and a wireless extension of wired IPv6 infrastructures. By operating in the sub-1GHz band, TI’s 6LoWPAN solutions offer longer wireless range at lower power levels than traditional 2.4 GHz-based 6LoWPAN offerings.
Read more Group will define 100G backplanes, cables
September 26, 2011
A new group aims to hammer out by March 2014 standards for running 100 Gbit/second Ethernet signals over backplanes and copper cables. The IEEE P802.3bj task force will plow a path for the next generation of data center and carrier systems that already are being outfitted with 40 and 100G Ethernet line interfaces.
Read more Nvida ups ante with five-core mobile chip
September 21, 2011
Nvidia will pack five cores into its next-generation mobile CPUs using a novel technique it describes as Variable Symmetric Multiprocessing (vSMP) to claim a power efficiency edge over rivals Qualcomm and Texas Instruments.
Read more Motion algorithms lift MEMS-based remotes
September 16, 2011
Armed with a new deal to integrate its MEMS sensor algorithms into Texas Instruments's ZigBee-based radio frequency for consumer electronics (RF4CE) hardware platform—RemoTI—Hillcrest Laboratories Inc., hopes to penetrate further into the fast growing markets for MEMS-based motion-control interfaces for Smart TV, streaming video, motion-based gaming and 3-D gesture control.
Read more TI launches 10 new Bluetooth low energy profiles for rapid design of consumer medical, fitness, alert applications
August 30, 2011
Texas Instruments Incorporated has launched ten Bluetooth low energy technology (Bluetooth v4.0) profiles with associated sample applications to boost market development of Bluetooth low energy-compliant sensor devices. The Bluetooth low energy application software is a part of TI's BLE-Stack, and is available royalty-free to all using TI's CC2540 Bluetooth low energy system-on-chip (SoC).
Read more Base station SoC now features LTE PHY software
August 2, 2011
LTE software licensing company, mimoOn, has announced that its 3GPP compliant LTE PHY software will be supplied ready-integrated by Texas Instruments for its KeyStone multicore architecture, with a special focus on latest SoCs which target small base stations in the enterprise, pico and metro markets.
Read more Ten mobile vendors license chip interconnect
July 27, 2011
Ten cellphone chip makers have licensed the Chip-to Chip Link (C2C) specification developed by Arteris Inc., and Texas Instruments. C2C is one of three low latency interconnects TI helped develop to let applications processors and modems share memory.
Read more High-performance voltage regulator adds 20-percent run-time to ultra-low power wireless applications
July 26, 2011
Texas Instruments Incorporated has introduced a 3-MHz, 100-mA synchronous step-down DC/DC converter, which integrates a bypass switch and a unique DCS-Control technology. The new device extends battery run-time by 20 percent in low-power wireless and MSP430 MCU-based applications, when compared to competing solutions.
Read more Smartphone processor sales surged in Q1
June 20, 2011
Global revenue from smartphone applications processors reached $1.68 billion in the first quarter, up a whopping 108 percent compared to the first quarter of 2010, while cellular baseband sales grew 20 percent year-to-year, according to market research firm Strategy Analytics Inc.
Read more Open source wireless connectivity solutions for low power applications
April 13, 2011
Texas Instruments has announced delivery of a mobile-grade, battery-optimized Wi-Fi solution to the open source Linux community as part of the OpenLink™ project, focused on providing a wide range of wireless connectivity solutions for native Linux.
Read more Body network spars with Bluetooth
February 23, 2011
An emerging body area network (BAN) technology is gearing up to compete with Bluetooth Low Energy across a broad range of medical and consumer applications. The competition comes as medical devices are increasingly adopting a growing set of wireless network technologies including Wi-Fi and Zigbee.
Read more Algorithm paves path to better video
February 23, 2011
A Texas Instruments researcher described a parallel approach to handling current and future compression standards.
Read more Multiple cores power fifth generation of TI's OMAP
February 8, 2011
Texas Instruments' believes its OMAP 5 platform is expected to change the concept of 'mobile' by driving disruptive mobile computing experiences providing stereoscopic 3D, gesture recognition and computational photography based on multi-core processing, including ARM Cortex-A15 MPCore processors.
Read more Ceva claims top spot for cell phone DSP
February 1, 2011
DSP intellectual property supplier Ceva Inc. has claimed that is now the world's leading DSP architecture deployed in cellular baseband processors.
Read more TI selects Movea's MotionIC platform for RF4CE remote control reference design
January 11, 2011
Movea has partnered with Texas Instruments Incorporated (TI) to create a high-performance, RF4CE remote control reference design that will allow consumers to experience a highly interactive and immersive style of home entertainment by enabling in-air operating controls through motion recognition.
Read more TI releases tools and chipset for wireless power
January 5, 2011
Texas Instruments has introduced what is says is the industry's first Qi-certified wireless power development kit, which enables design engineers to speed the integration of wireless power technology in consumer electronics, such as digital cameras, smartphones, MP3 players and global positioning systems, along with infrastructure applications such as furniture and cars.
Read more Qi certified development tools and chipset for wireless power
January 4, 2011
Texas Instruments introduced what the company claims to be the industry's first Qi certified wireless power development kit, which enables design engineers to speed the integration of wireless power technology in consumer electronics, such as digital cameras, smartphones, MP3 players and global positioning systems, along with infrastructure applications such as furniture and cars.
Read more Radio module family targets broad electronics market
November 17, 2010
Anaren has launched a family of Anaren Integrated Radio (AIR) modules designed for the broad electronics market. Working closely with Texas Instruments as a member of the TI Developer Network, Anaren developed the five-module AIR family to provide a more elegant, FCC Certified, 'plug and play' RF solution to electronic engineers challenged with adding wireless capability to new or existing devices.
Read more Freescale basestation DSP tops TI's
November 17, 2010
Freescale Semiconductor appeared to one-up Texas Instruments Wednesday (November 17) by rolling out a digital signal processor (DSP) core that achieved a higher rating from benchmarking consulting firm BDTI Inc. Last week, TI reported that its C66x DSP core achieved a BDTImark2000 score of 16,690. Freescale countered Wednesday that its new redesigned SC3850 core achieves a BDTImark2000 score of 18,500.
Read more LTE PHY and software stack for TI C66x DSPs
November 10, 2010
MimoOn has announced the availability of mimoOn's LTE PHY and stack software for macro and small cell basestations for Texas Instruments C66x digital signal processors (DSPs). MimoOn's Layer 1 SW has been integrated onto TI's C66x-based, flexible, scaleable processor targeting LTE wireless infrastructure.
Read more TI to put floating point in every DSP core
November 10, 2010
The cellular base station market is heating up – worldwide. As this happens, the competition between Texas Instruments and Freescale Semiconductor over base station SoCs is accelerating. The companies are intensifying efforts to promote novel designs for DSP cores, accelerators and microprocessors – to enable flexible and powerful 3G and LTE/4G base stations
Read more Thin EMI filters with high ESD performance
October 7, 2010
Texas Instruments has introduced six- and four-channel electromagnetic interference (EMI) filters for portable and LCD display applications, the TPD6F202 and TPD4F202. Electrostatic discharge (ESD) ratings exceed the IEC 61000-4-2 specification by at least three times for contact discharge. Both are 67 percent better than the specification for air-gap discharge.
Read more Extreme Reality partners with Texas Instruments on OMAP-optimized gesturing engine
September 13, 2010
Extreme Reality has partnered with Texas Instruments to deliver a touchless gesturing engine and gesturing application framework for mobile devices. This announcement builds on the vision that TI and XTR first demonstrated earlier this year at Mobile World Congress, as part of TI's natural user interfaces (NUI) initiatives.
Read more Windows Embedded CE 6.0 drivers for TI's WiLink™ 6.0 chip
September 8, 2010
Adeneo Embedded with facilities in Europe and in the USA, has announced availability of its Wi-Fi® and Bluetooth® technology drivers for the WiLink™ 6.0 single-chip solution (WL1271) from Texas Instruments (TI) which support Windows Embedded CE 6.0 R3. The customizable, combined solution makes the design of reliable, high-performance wireless communications on the Windows Embedded CE operating system more efficient.
Read more TI announced as the first licensee of the next generation ARM Cortex-A series processor core
August 10, 2010
Building on its rich heritage of collaboration with ARM, Texas Instruments Incorporated (TI) has confirmed that it was the first company to partner with ARM in the conception and definition of the next generation ARM® Cortex™-A series processor core (also known as "Eagle") to be announced later this year. TI intends to use the new processor to further strengthen and extend its future OMAP™ platform offerings.
Read more TI announces fully qualified Bluetooth low energy stack
July 8, 2010
The Bluetooth Special Interest Group (SIG) has announced adoption of Bluetooth low energy technology, the hallmark feature of the Bluetooth Core Specification Version 4.0. In conjunction, Texas Instruments (TI) announced full qualification of the Bluetooth low energy stack supporting the BlueLink and WiLink connectivity combo solutions.
Read more Multicore system-on-a-chip architecture addresses femtocell applications
June 22, 2010
Texas Instruments is developing new femtocell devices based on its recently announced multicore System-on-a-Chip (SoC) architecture, which integrates both fixed and floating point capabilities in the industry's highest performing central processing unit (CPU).
Read more FilterPro v3.0 design tool eases amplifier filter design
May 11, 2010
Texas Instruments Incorporated has introduced the latest version of its popular FilterPro™ design tool.
Read more SATA 3-Gbps redriver for mobile and computing applications
March 18, 2010
Texas Instruments has introduced an ultra low-power, two-channel SATA 3-Gbps redriver and signal conditioner that can extend the interconnect distance between a SATA host and an eSATA connector.
Read more HDI to change how consumers interact with mobile devices
March 15, 2010
With investments from Texas Instruments Incorporated and GetFugu, Inc., the MobileLab research group at the University of Texas at Dallas (UT Dallas) stands at the forefront of enabling next-generation human device interactions (HDI) technologies that merge a physical, real-world environment with virtual, computer-generated imagery on mobile devices. Each holding unique technologies that significantly advance HDI applications, TI and GetFugu are committed to helping UT Dallas researchers bring immersive applications to the end users around the world, providing quick access to information, always-on connections and revolutionary multimedia experiences.
Read more