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2012 chip market to grow 7% May 1, 20122012 chip market to grow 7% Growth in the semiconductor market will accelerate in the second half of 2012 and achieve an annual percentage figure of 6 to 7 percent, according to Mali Venkatesan, research manager for semiconductors at International Data Corp. Read more GainSpan reference design code for TI MSP430 offers easy Wi-Fi connectivity April 30, 2012GainSpan reference design code for TI MSP430 offers easy Wi-Fi connectivity GainSpan® Corporation has introduced reference design code for Texas Instruments' MSP430 that significantly reduces the development time to add Wi-Fi connectivity to embedded systems based upon this microcontroller (MCU). This code makes it possible for designers to rapidly develop their application on the MSP430 and easily communicate with a GainSpan Wi-Fi module of choice through a serial interface, using straightforward AT commands, with the GainSpan Wi-Fi module providing all Wi-Fi and networking functionalities. Read more Stereo spatial array IC brings immersive audio experience to smartphones and tablets April 19, 2012Stereo spatial array IC brings immersive audio experience to smartphones and tablets Texas Instruments Incorporated has introduced an IC that converts a smartphone or tablet computer’s narrow soundstage into a much wider audio experience for consumers to offer a more immersive audio experience. Read more Broadcom, Qualcomm, CSR, and Texas Instruments are benefiting from $8 billion wireless connectivity IC market April 18, 2012Broadcom, Qualcomm, CSR, and Texas Instruments are benefiting from $8 billion wireless connectivity IC market Wireless connectivity ICs totaled more than $8 billion in 2011 and will produce revenues close to $40 billion for Bluetooth, Wi-Fi, NFC, GPS, and combo ICs through 2016 according to ABI Research. Read more Multicore DSPs deliver performance and low power in small form factor March 27, 2012Multicore DSPs deliver performance and low power in small form factor Texas Instruments has unveiled three devices based on its KeyStone multicore architecture utilizing the TMS320C66x DSP generation. The TMS320C665x DSPs feature combined fixed- and floating-point capabilities, delivering real-time high performance at low power coupled with smaller form factors. Read more
TI announces partnership to take OMAP into robotics
TI and Aricent collaborate on small cell protocol stack optimized for KeyStone multicore processors
Avago, TI hit signal milestones
Texas Instruments shows off Pico HD projector that fits into a smartphone
High performance AFE targets femtocells and SDR
KeyStone multicore architecture scaled to support cloud RAN applications
Sub-1GHz wireless connection kit for TI LaunchPad development kit
SoC wireless audio products feature USB support
Sub-1 GHz 6LoWPAN solutions deliver mesh wireless Internet connectivity to metering networks
Group will define 100G backplanes, cables
Nvida ups ante with five-core mobile chip
Motion algorithms lift MEMS-based remotes
TI launches 10 new Bluetooth low energy profiles for rapid design of consumer medical, fitness, alert applications
Base station SoC now features LTE PHY software
Ten mobile vendors license chip interconnect
High-performance voltage regulator adds 20-percent run-time to ultra-low power wireless applications
Smartphone processor sales surged in Q1
Open source wireless connectivity solutions for low power applications
Body network spars with Bluetooth
Algorithm paves path to better video
Multiple cores power fifth generation of TI's OMAP
Ceva claims top spot for cell phone DSP
TI selects Movea's MotionIC platform for RF4CE remote control reference design
TI releases tools and chipset for wireless power
Qi certified development tools and chipset for wireless power
Radio module family targets broad electronics market
Freescale basestation DSP tops TI's
LTE PHY and software stack for TI C66x DSPs
TI to put floating point in every DSP core
Thin EMI filters with high ESD performance
Extreme Reality partners with Texas Instruments on OMAP-optimized gesturing engine
Windows Embedded CE 6.0 drivers for TI's WiLink™ 6.0 chip
TI announced as the first licensee of the next generation ARM Cortex-A series processor core
TI announces fully qualified Bluetooth low energy stack
Multicore system-on-a-chip architecture addresses femtocell applications
FilterPro v3.0 design tool eases amplifier filter design
SATA 3-Gbps redriver for mobile and computing applications
HDI to change how consumers interact with mobile devices


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