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DSP-based 5 V Qi wireless charger in 5 x 5 mm February 26, 2014DSP-based 5 V Qi wireless charger in 5 x 5 mm At Mobile World Congress, NXP Semiconductors is demonstrating a revolutionary Qi wireless charging transmitter device, which integrates all the circuits for a 5-V mobile phone charger in an extremely small package measuring only 5-mm square. Read more LTE SOC to drive 64-bit mobile computing February 24, 2014LTE SOC to drive 64-bit mobile computing Designed to provide next-generation computing, the MT6732 64-bit LTE SOC from Mediatek comprises a coherent 64-bit ARM quad-core, 1.5 GHz Cortex-A53 cluster and Mali-T760 GPU. Read more Global location chip targets wearables February 21, 2014Global location chip targets wearables Adding a new level of activity and location tracking to the growing fitness and wearable device market, Broadcom Corporation claims to offer the industry's first Global Navigation Satellite System (GNSS) system-on-chip (SoC), designed for low-power, mass-market wearable devices such as fitness trackers and smart watches. Read more MediaTek targets under-$50 wearable devices February 3, 2014MediaTek targets under-$50 wearable devices MediaTek is quietly going after the emerging market of under-$50 wearable devices. The company's new "all-in-one" SoC, called Aster, is sampling now only to a select group of customers. Read more Sondrel aids Chinese start-up QST with chip for mobile devices January 15, 2014Sondrel aids Chinese start-up QST with chip for mobile devices Sondrel, a leading system-to-silicon IC design consultancies, has announced details of a successful partnership with QST Corporation, a start-up semiconductor company in China focusing on innovative MEMS and other sensor products. Read more
Muscle activity-based gesture control enables wireless control of devices with fingers and hands alone
Spreadtrum licenses CEVA-TeakLite-4 audio/voice DSP for next generation smartphone SoC
Digi-Key adds low-power Wi-Fi manufacturer GainSpan
ZTE licenses CEVA-XC DSP for LTE TDD/FDD base station and network infrastructure
Five leading Japanese ODMs unveil nRF51822 SoC RF modules
Highly integrated processor SoC for 5G WiFi enterprise access points
Software-based super-resolution technology for low energy mobile applications
Design and verification IP support the new Mobile PCI Express specification
Nordic Semiconductor and Japanese partners demonstrate application development-ready Bluetooth low energy modules
Lowest-power speech recognition for mobile devices demonstrated
Evaluation kits aim to speed up ZigBee development projects
Developer's kit for ZigBee wireless applications
CEVA joins Heterogeneous System Architecture Foundation
Bluetooth low energy module enables pre-approved prototypes within hours
Ember® ZigBee® ICs target the Internet of Things
Mindspeed processors power small cell demonstrations at 4G World and ARM TechCon
RFEL makes FPGA performance available to ARM
SatixFy licenses CEVA-XC DSP for broadband satellite applications
Smart-meter SoC combines metrology, security and communication capabilities
Xilinx buys Estonian software house for mobile backhaul IP
Wireless SoC accelerated validation platforms for MIPI CSI-2 and DSI
Mindspeed teams with SpiderCloud for enterprise small cells
Battery-powered evaluation enables engineers to test wireless accessory and sensor applications
Multi-function SoC simultaneously navigates, plays movies and phones hands-free
FPGA hits 1-GHz benchmark
Bluetooth low energy application software targets wearable devices
SoCs bring ISDB transmissions to smartphones
Mindspeed adds support for smart DAS into small cells
Quad core SoC delivers HD audio for smartphones and tablets
28-nm based ARM Cortex-A9 test chip tops 3 GHz
Mindspeed powers first LTE + Wi-Fi femtocell for SK Telesys
Muddy mobile graphics waters dead ahead
Nordic to demo freespace pointing upgrade for RF Smart Remote reference design at ESC 2012
Compact SoC focuses on high-end hybrid set-top box applications
Symmetric end-to-end 10G-EPON SoCs
MIPI Alliance Low Latency Interface saves cost and board space
LTE-Advanced basestation on a chip
Deltenna and Octasic demonstrate a tiny UMTS and LTE-ready small cell
Quad-core mobile CPU from Samsung described at ISSCC
Intel targets data plane with new comms SoC
Multiple chip architectures pursue the $14 billion small cell market
Intel details Medfield for smartphones and announces Lenovo, Motorola deals
MediaTek debuts gigabit WiFi SoC
Smart ZigBee RF4CE SoC for motion sense remote controls
KeyStone multicore architecture scaled to support cloud RAN applications
Chinese company licenses S3 IP for mobile TV
STMicroelectronics and MTL develop ultra-low-voltage SoC for future wireless and implantable devicess
Multi-format high definition set top box SoC
Sub-1 GHz 6LoWPAN solutions deliver mesh wireless Internet connectivity to metering networks
TI launches 10 new Bluetooth low energy profiles for rapid design of consumer medical, fitness, alert applications
Qualcomm renames SoCs, quad-core on track
Base station SoC now features LTE PHY software
Complete range of LTE small cell and relay reference designs
TI unveils industry’s first complete wireless headset reference design
Development kit with touch pad eases transition from infrared to RF
DesignArt Networks delivers unified mobile backhaul paradigm
Industry’s first system-on-chip two-way radio enabling cost effective digital radios
Single-SoC platform targets low-cost indoor Picocell access points
Single-SoC platform for concurrent 3G and 4G service operation
Low-power 40-nm LTE Advanced baseband SoC delivers multi-sector performance
Ultra-low energy radio draws less than 3 mW
Fourth generation analog mobile TV receiver
Embedded Wi-Fi SoC targets Internet of Things market
TI to put floating point in every DSP core
Renesas Electronics to spin off its mobile multimedia SoC business
DesignArt Networks relies on Tensilica for 4G SoC family
SoC for wireless Bluetooth 2.1 mice improves battery life and tracking
System-on-chip device family for ZigBee RF4CE consumer electronics
TI announced as the first licensee of the next generation ARM Cortex-A series processor core
Wireless remote on a chip simplifies cost-sensitive one-way links
Multicore system-on-a-chip architecture addresses femtocell applications
Intel's 32-nm process ready for RF
TSMC to speed system-to-IC design cycles
Myriad Group speeds Android applications by 5x on the MIPS architecture
Synopsys claims industry's first MIPI DigRF v4 IP
2.5-GHz, 126-channel RF transceiver SoC achieves first-pass silicon


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