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Bluetooth Smart SoC ready for prototyping in through-hole 16-pin DIP January 18, 2016Bluetooth Smart SoC ready for prototyping in through-hole 16-pin DIP U.S. maker and hobbyist startup 'OSHChip' ('Open Source Hardware') now supplies a Nordic Semiconductor nRF51822 SoC in a unique 16-pin DIP package with IC-like through-hole pins. Read more Bluetooth® Smart SoCs link wearable devices to Apps for WeChat users December 8, 2015Bluetooth® Smart SoCs link wearable devices to Apps for WeChat users Dialog Semiconductor has announced its support for WeChat’s communications protocol, with the launch of the Dialog WeChat SDK. The kit enables developers to quickly add energy-efficient Bluetooth connectivity between WeChat apps and wearables or other IoT devices. Read more Silicon Labs acquires leading Zigbee module provider November 24, 2015Silicon Labs acquires leading Zigbee module provider Silicon Labs is acquiring Telegesis, a leading supplier of wireless mesh networking modules based on ZigBee® technology. A privately held company founded in 1998 and based near London, Telegesis has established itself as a ZigBee expert with strong momentum in the smart energy market, providing ZigBee modules to many of the world’s top smart metering manufacturers. Read more Dialog and Bosch collaborate on low power smart sensor wireless platform for IoT devices October 13, 2015Dialog and Bosch collaborate on low power smart sensor wireless platform for IoT devices Dialog Semiconductor plc is collaborating with Bosch Sensortec to create an extremely low power smart sensor platform that combines Bosch Sensortec’s sensors with Dialog’s Bluetooth Smart technology. Read more High-level DSP tool simplifies wireless design October 7, 2015High-level DSP tool simplifies wireless design Xilinx has announced the 2015.3 release of System Generator for DSP, a leading high-level tool for designing high performance DSP systems using Xilinx® All Programmable devices. Read more
5.9 GHz band automotive wireless communications SoC meets ETSI standards
TSMC certifies ANSYS for 10-nanometer FinFETs
Quad-Core 64-bit R10 LTE carrier aggregation SoC platform
Fully integrated, pre-certified Bluetooth® Smart module
Thread protocol stack comes with powerful development tools
Programmable multi-processor SoC targets vision, ADAS, IoT, and 5G
Audio processor for Ambarella-based IP camera and wearable applications
Bluetooth Smart SoC doubles data rates for IoT devices
Wearable 3D home theater sound system
Altera joins the Industrial Internet Consortium to influence IoT
Bluetooth Smart SoC family targets wireless charging for IoT
Suite of IP from ARM targets low-power future premium mobile devices
Intel boosts wireless credentials with button size SoC for wearable devices
802.11ac SoC for Wi-Fi connectivity
Development Platform from RS Components innovates embedded and IoT applications
Ultra-low-power SoC for long-range Internet of Things connectivity
Broadcom cuts 2,500 jobs to exit cellular market
Bluetooth Smart protocol stack for wearable hub networks with wireless sensors
Wireless controller targets IoT with on-board user-application memory
DSP-based 5 V Qi wireless charger in 5 x 5 mm
LTE SOC to drive 64-bit mobile computing
Global location chip targets wearables
MediaTek targets under-$50 wearable devices
Sondrel aids Chinese start-up QST with chip for mobile devices
Muscle activity-based gesture control enables wireless control of devices with fingers and hands alone
Spreadtrum licenses CEVA-TeakLite-4 audio/voice DSP for next generation smartphone SoC
Digi-Key adds low-power Wi-Fi manufacturer GainSpan
ZTE licenses CEVA-XC DSP for LTE TDD/FDD base station and network infrastructure
Five leading Japanese ODMs unveil nRF51822 SoC RF modules
Highly integrated processor SoC for 5G WiFi enterprise access points
Software-based super-resolution technology for low energy mobile applications
Design and verification IP support the new Mobile PCI Express specification
Nordic Semiconductor and Japanese partners demonstrate application development-ready Bluetooth low energy modules
Lowest-power speech recognition for mobile devices demonstrated
Evaluation kits aim to speed up ZigBee development projects
Developer's kit for ZigBee wireless applications
CEVA joins Heterogeneous System Architecture Foundation
Bluetooth low energy module enables pre-approved prototypes within hours
Ember® ZigBee® ICs target the Internet of Things
Mindspeed processors power small cell demonstrations at 4G World and ARM TechCon
RFEL makes FPGA performance available to ARM
SatixFy licenses CEVA-XC DSP for broadband satellite applications
Smart-meter SoC combines metrology, security and communication capabilities
Xilinx buys Estonian software house for mobile backhaul IP
Wireless SoC accelerated validation platforms for MIPI CSI-2 and DSI
Mindspeed teams with SpiderCloud for enterprise small cells
Battery-powered evaluation enables engineers to test wireless accessory and sensor applications
Multi-function SoC simultaneously navigates, plays movies and phones hands-free
FPGA hits 1-GHz benchmark
Bluetooth low energy application software targets wearable devices
SoCs bring ISDB transmissions to smartphones
Mindspeed adds support for smart DAS into small cells
Quad core SoC delivers HD audio for smartphones and tablets
28-nm based ARM Cortex-A9 test chip tops 3 GHz
Mindspeed powers first LTE + Wi-Fi femtocell for SK Telesys
Muddy mobile graphics waters dead ahead
Nordic to demo freespace pointing upgrade for RF Smart Remote reference design at ESC 2012
Compact SoC focuses on high-end hybrid set-top box applications
Symmetric end-to-end 10G-EPON SoCs
MIPI Alliance Low Latency Interface saves cost and board space
LTE-Advanced basestation on a chip
Deltenna and Octasic demonstrate a tiny UMTS and LTE-ready small cell
Quad-core mobile CPU from Samsung described at ISSCC
Intel targets data plane with new comms SoC
Multiple chip architectures pursue the $14 billion small cell market
Intel details Medfield for smartphones and announces Lenovo, Motorola deals
MediaTek debuts gigabit WiFi SoC
Smart ZigBee RF4CE SoC for motion sense remote controls
KeyStone multicore architecture scaled to support cloud RAN applications
Chinese company licenses S3 IP for mobile TV
STMicroelectronics and MTL develop ultra-low-voltage SoC for future wireless and implantable devicess
Multi-format high definition set top box SoC
Sub-1 GHz 6LoWPAN solutions deliver mesh wireless Internet connectivity to metering networks
TI launches 10 new Bluetooth low energy profiles for rapid design of consumer medical, fitness, alert applications
Qualcomm renames SoCs, quad-core on track
Base station SoC now features LTE PHY software
Complete range of LTE small cell and relay reference designs
TI unveils industry’s first complete wireless headset reference design
Development kit with touch pad eases transition from infrared to RF
DesignArt Networks delivers unified mobile backhaul paradigm
Industry’s first system-on-chip two-way radio enabling cost effective digital radios
Single-SoC platform targets low-cost indoor Picocell access points
Single-SoC platform for concurrent 3G and 4G service operation
Low-power 40-nm LTE Advanced baseband SoC delivers multi-sector performance
Ultra-low energy radio draws less than 3 mW
Fourth generation analog mobile TV receiver
Embedded Wi-Fi SoC targets Internet of Things market
TI to put floating point in every DSP core
Renesas Electronics to spin off its mobile multimedia SoC business
DesignArt Networks relies on Tensilica for 4G SoC family
SoC for wireless Bluetooth 2.1 mice improves battery life and tracking
System-on-chip device family for ZigBee RF4CE consumer electronics
TI announced as the first licensee of the next generation ARM Cortex-A series processor core
Wireless remote on a chip simplifies cost-sensitive one-way links
Multicore system-on-a-chip architecture addresses femtocell applications
Intel's 32-nm process ready for RF
TSMC to speed system-to-IC design cycles
Myriad Group speeds Android applications by 5x on the MIPS architecture
Synopsys claims industry's first MIPI DigRF v4 IP
2.5-GHz, 126-channel RF transceiver SoC achieves first-pass silicon

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