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Samsung Galaxy S4 carries $236 bill of materials March 20, 2013Samsung Galaxy S4 carries $236 bill of materials The HSPA+ version of Samsung Electronics’ Galaxy S4 smartphone carries a $236 bill of materials (BOM), up significantly from last year’s model—the Galaxy S III—due to major upgrades in the display, sensors and application processor and supporting memory, according to a virtual teardown conducted by the IHS iSuppli Mobile Handset Cost Model Service at information and analytics provider IHS. Read more Intel says no LTE integration until 2014 February 3, 2013Intel says no LTE integration until 2014 Intel Corp., is making progress with its development of LTE modems but does not expect to have an integrated LTE modem and application processor until 2014, according to CEO Paul Otellini. Read more Samsung drops Qualcomm for own chipset in Galaxy SIII E210s November 21, 2012Samsung drops Qualcomm for own chipset in Galaxy SIII E210s ​The Galaxy SIII E210s was released in Korea recently and with its launch, Samsung sent a message to the chipset giant Qualcomm by dropping the Qualcomm modem in favor of its home grown solution. Read more Intel gains toe hold in smartphone apps processor market October 10, 2012Intel gains toe hold in smartphone apps processor market Intel recorded a 0.2 percent share by unit shipments of the global smartphone applications processor market in the first half of 2012, up from zero previously, according to market researcher Strategy Analytics. Meanwhile, Qualcomm maintained market dominance with 48 percent revenue share. Read more Intel looks to beat ARM on power consumption beyond 20 nm September 25, 2012Intel looks to beat ARM on power consumption beyond 20 nm Though ARM may currently have an advantage in low power processing, Intel believes it could eventually take the lead if it maintains its current pace of advancement in process technology. Read more
Intel energizes wireless charging effort
Jaguar processor from AMD boasts four cores for mobile applications
RF/IF rackmount recorder offers dual channels for ultra wideband signals
Intel adds power amplifiers to 3G RF chip
Ubiquisys demonstrates smart cells based on Intel architecture in mobile network
Automotive cellular M2M communications module claims to be smallest on the market
Huawei to give Intel LTE development support in China
Intel grabs 15% of cellular baseband market
Digi International and Wind River cooperate on cloud-connected wireless M2M solutions
Intel's new partnerships and processors for the mobile space
Path to optical links still dark
Intel focuses on low power, digital RF
Intel targets data plane with new comms SoC
3-D IC standards needed within six months
Analyst claims Windows on ARM will not be much of a success
Intel details Medfield for smartphones and announces Lenovo, Motorola deals
Inside Secure agrees technology transfer and services agreements with Intel
IMEC brings back ultrawideband
Group will define 100G backplanes, cables
Ubiquisys collaborates with Intel to develop intelligent small cells
Redpine rolls flexible Wi-Fi chip set
At mobile impasse, Intel tips Atom progress
MIPS: Android remains processor neutral
Molex antenna business unit joins Danish SAFE (Smart Antenna Front End) consortium
Intel's mobile chief resigns
Intel buys Egyptian communications startup
Report: Microsoft to pay Nokia $1 billion for support
Baseband mania hits Mobile World
Nokia/Microsoft alliance carries downside for cell phone giant
IEEE drafts hybrid home net standard
Intel licenses DSP
Intel to acquire Dresden LTE firm
Nvidia: ARM smartphones will bury x86 PCs
Analyst: iPhone to sole source Qualcomm chip
Intel taps junctionless transistor research
Intel will run wireless as separate business
Intel to acquire Infineon’s Wireless Solutions business
MeeGo in-vehicle win gives embedded Intel a boost
WiMax shrinking, LTE has issues
Intel's 32-nm process ready for RF
PicoChip raises $20 million for femto push
CSR and Intel to collaborate on Bluetooth and Wi-Fi combination solution for PCs
60 GHz groups face off in Beijing over Wi-Fi's future


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