October 19, 2011 Chicago will need approximately 84,500 small cells to deliver truly high-speed LTE by 2015, with acceptable coverage and speeds, according to analysis from Picochip. To provide LTE everywhere in the US around 1.8 million small cells would be required, based on estimations on data growth and usage across the country. This is in addition to residential femtocells and Wi-Fi. Read more

October 17, 2011 Cinterion has released what the company claims to be the world's thinnest HSPA+ M2M module, featuring flexible surface mounting technology and enabling secure, high-speed voice and data communications on global 2G and 3G cellular networks. Read more

July 20, 2011 China telecom giant Huawei Technologies is producing its own HSPA baseband silicon, according to a new teardown report by ABI Research. The discovery of the chip raises questions about how far Huawei's ambitions extend in basebands at a time when LTE networks are on the rise. Read more

April 6, 2011 Anritsu introduces a software option for its MD8480C W-CDMA/GSM Signaling Tester that enables testing for the latest W-CDMA/GSM devices supporting simultaneous 64QAM and MIMO. Read more

March 23, 2011 Ericsson has launched two cellular modules it hopes to get integrated into digital cameras, MP3 players and other consumer devices. The news comes days after rival Sierra Wireless won a deal to integrate one of its cellular modules in a mobile glucose meter. Read more

March 23, 2011 Telit Wireless Solutions has launched the HE910, which claims to be the smallest module available featuring 5-band HSPA+. The module can thus be used in any 3G network worldwide without the need for regional variants. Read more

March 18, 2011 To future-proof data transmission devices against non-availability of the 2G network, Telit is launching the HE series. The Telit HE863, the first module in the new series, is a powerful, low-cost and fully equipped HSPA M2M module with embedded GPS receiver and 22 GPIOs (General Purpose Input/Outputs) in a ball grid array (BGA) form factor. Read more

March 2, 2011 Telit Wireless Solutions is launching the Telit HE863 – the first model in a new module series. The HE863 is a powerful, low-cost and fully equipped HSPA M2M module in a ball grid array (BGA) form factor with embedded GPS receiver. It is intended for data transmission devices with a long lifetime that are intended for long-term use even after 2G network switch-off and require high throughput. Examples include smart metering, healthcare, surveillance and tracking applications. Read more

January 20, 2011 Picochip, Continuous Computing and Ixia have successfully collaborated to validate Continuous Computing's Trillium Long Term Evolution (LTE) and femtocell wireless protocol software solutions running on Picochip's picoArray hardware using Ixia's IxCatapult test platform. Read more

January 12, 2011 RF Micro Devices has announced it has achieved a major performance milestone related to its PowerSmart™ power platforms — a new product category reshaping the future of multimode, multi-band cellular RF architectures. Read more

January 6, 2011 AT&T is accelerating its plans to roll out LTE services and Android-based smartphones. The news comes in the wake of archrival Verizon turning on LTE services in early December, and rumors Verizon will offer a next-generation Apple iPhone soon. Read more

December 13, 2010 Building on its market leadership in residential femtocells, Picochip is extending its technology into the more traditional part of the public network, adding support for Iub network architectures to its recently-launched picoXcell™ PC333 HSPA+ device, and announcing plans for an optimized dual-mode LTE/HSPA+ basestation. Read more

November 24, 2010 Icera Inc. and Rohde & Schwarz are working together to enable the wireless industry to certify and deploy LTE technology. The Global Certification Forum (GCF) is currently working towards introducing LTE certification by the end of 2010. Read more

November 17, 2010 Icera Inc., and Anite (Fleet UK) have announced that they are working together to help accelerate the availability of LTE protocol conformance tests required by the industry's LTE device certification programmes. Both Icera and Anite are at the forefront of the development of multimode LTE products and the collaboration brings together the best of breed of Anite's Conformance Toolset with Icera's software-defined modem. Read more

November 17, 2010 Freescale Semiconductor appeared to one-up Texas Instruments Wednesday (November 17) by rolling out a digital signal processor (DSP) core that achieved a higher rating from benchmarking consulting firm BDTI Inc. Last week, TI reported that its C66x DSP core achieved a BDTImark2000 score of 16,690. Freescale countered Wednesday that its new redesigned SC3850 core achieves a BDTImark2000 score of 18,500. Read more

November 16, 2010 It is not economically viable to upgrade current UK mobile broadband networks to address traffic demands and improve user experience until 2015, according to the latest research from Informa Telecoms & Media. Due to the dense deployment needed to meet coverage requirements, UK HSPA networks will be able to handle current and future traffic demands in the medium-term. Read more

November 9, 2010 Is Intel Corp. re-entering the DSP business? In a major move, Intel has licensed Ceva Inc.'s digital signal processor (DSP) intellectual property (IP). Read more

October 27, 2010 Renesas Electronics Corporation has announced that it has decided to spin off, through an absorption-type separation, its Mobile Multimedia SoC Business Division and transfer the business to a new consolidated subsidiary, Renesas Mobile Corporation, effective as of December 1, 2010. Read more

October 19, 2010 Sierra Wireless has launched a suite of new products designed for LTE networks, claimed to provide users wireless access at download speeds of up to 100 Mbps and upload speeds up to 50 Mbps. It will support all major network technologies and offer compatibility with existing 2G and 3G services, to support national and international roaming worldwide. Read more

October 8, 2010 AnyDATA Corporation has announced they will develop modules and USB modems for the LightSquared LTE network. These innovative LTE devices will enable a new generation of consumer electronic and industrial M2M products to have wireless broadband connection literally anywhere in the continental U.S. Read more

October 6, 2010 ST-Ericsson has launched a power-efficient and compact HSPA+ modem capable of transmitting data at speeds of up to 21 Mbps. With up to fifty per cent lower power consumption than competing HSPA+ 21 Mbps modems available on the market, the highly-integrated M5730 will enable engineers to produce small, affordable and power-efficient HSPA+ smartphones, USB-dongles and embedded modules. Read more

September 15, 2010 IMS Research has just come out with figures estimating that the number of connected devices to the Internet has reached an important milestone of 5 Billion. Further, their latest forecast is for 22 billion Internet connected devices by 2020, which is one of the more conservative estimates in the industry. Read more

September 14, 2010 The PC333 from picoChip claims to be the first chip specifically designed to extend the femtocell into the realm of public access infrastructure such as metro femto, rural femto and strand-mounted systems. The SoC also claims to be the first femtocell chip to support 32 channels (scalable to 64) for simultaneous voice and HSPA+ data, the first to support MIMO, the first to support soft-handover and the first to conform to the Local Area Basestation (LABS) standard. Read more

September 8, 2010 Continuous Computing and NetLogic Microsystems have announced their collaboration to deliver the industry's highest performance 40G AdvancedTCA (ATCA) packet processing platforms using NetLogic Microsystems' XLP™ multi-core, multi-threaded processors with 64 NXCPUs™, the NL11k knowledge-based processors and 10GE PHY solutions. Read more

July 28, 2010 PicoChip has signed an agreement with Entuple Technologies, to develop and bring to market the world's most advanced 3G and 4G femtocell technologies to Indian industry and academia. Under the agreement, Entuple will provide sales, engineering and systems integration support, covering HSPA+ femtocells, rural femtocells and LTE technology. Read more

July 27, 2010 Icera has announced that its HSPA+ soft modem, supporting HSPA+ Release 7 features to deliver 21 Mbps peak data rates and 5.76 Mbps in the uplink, is powering BandRich's Bandluxe USB stick, C330, C331, and C339, now available on multiple carrier networks globally. Read more

July 12, 2010 ST-Ericsson and Ericsson have showcased the first complete end-to-end TD-LTE solution. The demonstration follows the successful execution of TD-LTE interoperability testing (IOT) between ST-Ericsson's device platform and mobile network equipment from Ericsson. Read more

July 8, 2010 ST-Ericsson and Sagem Wireless collaborate on multimode platform for launch of commercial multimode LTE/HSPA+ products in 2010 Read more

July 7, 2010 Mobile broadband of the HSPA/LTE variety accounted for 17.3 percent of the total number of broadband connections in Europe at the end of 2009, according to market research company Berg Insight. Read more

July 6, 2010 Renesas Electronics Corporation and Nokia Corporation are increasing their collaboration by forming a strategic business alliance to develop modem technologies for HSPA+/LTE (Evolved High-Speed Packet Access / Long-Term Evolution) and its evolution. Read more

June 30, 2010 Anritsu Company has introduced hardware and software for its MT8820C that extends the capability of the tester to support measurement of parametric data during an LTE test mode call. Read more

June 29, 2010 Novatel Wireless has introduced the Expedite™ E351, Expedite™ E362 and Expedite™ E371 embedded modules, extending its embedded mobile broadband portfolio to next-generation connectivity. Read more

June 18, 2010 Mobile communications technology company Qualcomm Inc. could come under an investigation by the European Commission after allegations that it has used incentives to try and dissuade customers from dealing with U.K. company Icera Inc. Read more

June 17, 2010 Cognovo has announced its Software Defined Modem (SDM) platform designed to significantly reduce cost, size and design complexity for developers of cellular handsets and other wireless enabled consumer electronic products. Read more

June 1, 2010 Qualcomm Incorporated has sampled its first dual-CPU Snapdragon™ chipsets. The Mobile Station Modem™ (MSM™) MSM8260™ and MSM8660™ integrate two of the company's enhanced cores running at up to 1.2 GHz. Read more

April 28, 2010 Sony Corporation of America and IPWireless, a leading provider of 3rd Generation Partnership Project (3GPP) technology for new applications and markets, have announced that the two companies have signed an agreement to jointly research and develop wireless technologies for 4G and beyond. The two companies will initially focus on enhancing Long Term Evolution (LTE) technology for new applications and services with work beginning immediately. Read more

April 26, 2010 Icera Inc has announced that its Livanto® chipset is powering the USB modem from LG Mobile Phones which launched with AT&T in the US, the AT&T USBConnect Turbo. Read more

March 18, 2010 AnyDATA Corporation has announced the DTW series of low cost embedded CDMA and GSM/HSPA modules designed for mobile Internet devices. The tiny broadband modules measure only 21-mm x 22-mm x 4.5-mm, which is smaller in size than a quarter and weighs only 4 grams. Read more

March 18, 2010 Qualcomm Incorporated has filed an application with the Indian Government to bid in India's upcoming auction for BWA (Broadband Wireless Access) spectrum in the 2.3 GHz band to facilitate the deployment of TD-LTE. TD-LTE is compatible with 3G WCDMA/HSPA and EV-DO, and will enable a seamless broadband experience for consumers within India and while roaming globally. Read more

February 25, 2010 The RF720x WCDMA/HSPA+ power amplifier (PA) family from RF Micro Devices has entered into high volume production. Read more